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0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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sensata.com/burninsockets


Site Updated September 19, 2017

* * * Sensata > Products > Burn-in Sockets > BGA > CSP >

Burn-in Test Socket: 0.4 mm Pitch CSP
Available in Compression Mount or Through–hole


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Proven contact — No contact on bottom of ball, contact life exceeds 10,000 actuations
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Small socket outline — From 26x19.5mm to 40x40mm
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Interchangeable adapter
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Various package sizes available — up to 15x15mm
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Assembled in controlled environment
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Open top — Open top auto–load actuated socket
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Through–hole and compression mount
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Low actuation force — From 1.2kg, depending on pin count


Mechanical Characteristics
Contact system
Buckling beam (more info)
Dual pinch (more info)
Package insertion force
ZIF
Contact force
Range: 10–14g/pin
Durability
Minimum: 10,000 actuations
Temperature range
-55°C to 150°C
Contact point
Side of solder ball
Actuation force
From 1.2kg, depending on pin count

Electrical Characteristics
Current rating
0.25 amp per pin @ 125°C
Insulation resistance
1000 Mohms at 500VDC
Dielectric voltage
Withstands 500VDC for 1 minute
Contact resistance at 10mA
Initial: 150 mohm maximum
After 10K cycles: 1 ohm maximum
Inductance
6nH at 50 MHz, approximately

SEM image of 0.50mm pitch BGA
This SEM image shows an array of solder balls on the 0.50mm BGA package after burn-in at 140°C. Note the uniformity of the alignment of the contact witness marks, illustrating the accurate alignment features of the Sensata socket.
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24/7 Worldwide Support
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CSP Leaders
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Interconnect Since 1970
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BGA 0.5mm pitch IC test socket by Sensata

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